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Rogers CLTE-XT High Frequency PCB 2-layer Boards 20mil 0.508mm Thick


Shipped: 28th-Nov-2023  

Allow us to introduce a type of our latest shipment of CLTE-XT PCBs, an exceptional line of printed circuit boards from us.

CLTE-XT Introduction:
Rogers CLTE-XT laminates combine micro-dispersed ceramic filler, PTFE, and woven fiberglass reinforcement to deliver unparalleled loss tangent improvement, minimal insertion loss, and exceptional dimensional stability. With CLTE-XT, you can rely on its outstanding performance across an extended temperature range.

Key Features:
Dielectric constant (DK) of 2.94 at 10 GHz, 23°C @ 50% RH, ensuring reliable signal transmission.
Dissipation factor of 0.0010 at 10 GHz, 23°C @ 50% RH, for efficient and high-performance circuitry.
Coefficient of Thermal Expansion (CTE): X-axis CTE of 12.7 ppm/°C, Y-axis CTE of 13.7 ppm/°C, Z-axis CTE of 40.8 ppm/°C.
Td (Decomposition Temperature): 539°C, ensuring stability in demanding thermal environments.
Tightest dielectric constant tolerance in the CLTE family, with a tolerance of +/- 0.03, guaranteeing precise performance.
Benefits:
High plated-through-hole reliability, ensuring robust connections.
Consistent performance from lot to lot, ensuring reliable and repeatable results.
Reduced circuit losses without compromising dimensional stability, facilitating efficient designs.
Stable dielectric constant with temperature changes, minimizing stress on ceramic active devices.

PCB Stackup: 2-layer rigid PCB
Copper_layer_1: 35 μm
Rogers CLTE-XT Core: 0.508 mm (20 mil)
Copper_layer_2: 35 μm

PCB Construction Details:
Board dimensions: 53.18 mm x 76.04 mm (1 PCS), with a tolerance of +/- 0.15 mm.
Minimum Trace/Space: 4/5 mils
Minimum Hole Size: 0.4 mm
No blind vias
Finished board thickness: 0.6 mm
Finished copper weight: 1 oz (1.4 mils) for outer layers
Via plating thickness: 20 μm
Surface finish: Immersion Silver
Top Silkscreen: White
No bottom silkscreen
Top Solder Mask: Green
No bottom solder mask
100% Electrical test conducted before shipment

PCB Statistics:
Components: 12
Total Pads: 48
Thru-Hole Pads: 32
Top SMT Pads: 16
Bottom SMT Pads: 0
Vias: 56
Nets: 2
Artwork Type: Gerber RS-274-X
Quality Standard: IPC-Class-2
Availability: Worldwide

Typical Applications:
Advanced Driver Assistance Systems (ADAS)
Patch Antennas
Phased Array Antennas
Power Amplifiers

Appendix: CLTE-XT Data sheet

 

Properties

CLTE-XT

Units

Test Conditions

Test Method

Electrical Properties

Dielectric Constant

2.79 (5.1mil)

-

23˚C @ 50% RH

10 GHz

IPC TM-650 2.5.5.5

2.89 (9.4mil)

2.92 (20mil)

2.94 (30mil)

Dissipation Factor

0.0010

-

23˚C @ 50% RH

10 GHz

IPC TM-650 2.5.5.5

Dielectric Constant (design)

2.93

-

C-24/23/50

10 GHz

Microstrip Differential Phase Length

Thermal Coefficient of Dielectric Constant

-8

ppm/˚C

-50°C to 150°C

10 GHz

IPC TM-650 2.5.5.5

Volume Resistivity

4.25x10⁸

Mohm-cm

C-96/35/90

-

IPC TM-650 2.5.17.1

Surface Resistivity

2.49x10⁸

Mohm

C-96/35/90

-

IPC TM-650 2.5.17.1

Electrical Strength (dielectric strength)

1000

V/mil

-

-

IPC TM-650 2.5.6.2

Dielectric Breakdown

58

kV

D-48/50

X/Y direc- tion

IPC TM-650 2.5.6

Thermal Properties

Decomposition Temperature (Td)

539

˚C

2hrs @ 105˚C

5% Weight Loss

IPC TM-650 2.3.40

Coefficient of Thermal Expansion - x

12.7

ppm/˚C

-

-55˚C to 288˚C

IPC TM-650 2.4.41

Coefficient of Thermal Expansion - y

13.7

ppm/˚C

-

-55˚C to 288˚C

IPC TM-650 2.4.41

Coefficient of Thermal Expansion - z

40.8

ppm/˚C

-

-55˚C to 288˚C

IPC TM-650 2.4.41

Thermal Conductivity

0.56

W/(m.K)

-

z direction

ASTM D5470

Time to Delamination

>60

minutes

as-received

288˚C

IPC TM-650 2.4.24.1

Mechanical Properties

Copper Peel Strength after Thermal Stress

1.7
(9)

N/mm (lbs/ in)

10s @288˚C

35 μm foil

IPC TM-650 2.4.8

Flexural Strength (MD, CMD)

40.7, 40.0
(5.9, 5.8)

MPa (ksi )

25˚C ±?3˚C

-

ASTM D790

Tensile Strength (MD, CMD)

29.0, 25.5
(4.2, 3.7)

MPa (ksi )

23C/50RH

-

ASTM D638

Flex Modulus (MD. CMD)

3247, 3261
(471, 473)

MPa (ksi )

25C ±?3C

-

ASTM D790

Dimensional Stability (MD, CMD)

-0.37, -0.67

mm/m

4 hr at 105˚C

-

IPC-TM-650 2.4.39a

Physical Properties

Flammability

V-0

-

-

C48/23/50 & C168/70

UL 94

Moisture Absorption

0.02

%

E1/105+D24/23

-

IPC TM-650 2.6.2.1

Density

2.17

g/cm³

C-24/23/50

-

ASTM D792

Specifc Heat Capacity

0.61

J/g˚K

2 hours at 105˚C

-

ASTM E2716

NATA Outgassing

Total Mass Lost

0.02

%

-

-

ASTM E595

Collected Volatiles Condensable Material

0

 
 
 
 
 
 
 
 
 
 
 
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