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CLTE-XT High Frequency PCB

Introduction

Good morning and greetings, everyone. Welcome back to our channel. We’re delighted to share valuable insights with you in the field of RF PCB technology.

Today, we’ll be discussing a type of special RF laminates that utilizing extended technology for higher performance and the PCBs built upon them: Rogers CLTE-XT PCB.

CLTE-XT laminates consist of a combination of micro-dispersed ceramic filler, PTFE, and woven fiberglass reinforcement, aiming to enhance loss tangent while ensuring excellent dimensional stability. They offer the lowest insertion loss and the highest level of dimensional stability within its category. Building upon the reliability of CLTE laminates, CLTE-XT maintains its properties across an even broader temperature range.

Now let’s explore the various properties of CLTE-XT and their corresponding test methods.

Data sheet

CLTE-XT materials are engineered to deliver exceptional electrical performance, thermal stability, mechanical strength, and other desirable characteristics.

Electrical Properties

CLTE-XT exhibits a dielectric constant ranging from 2.79 to 2.94 at different thicknesses, such as 5.1mil, 9.4mil, 20mil, and 30mil. These measurements were conducted at 10 GHz and 23°C with 50% relative humidity using the IPC TM-650 2.5.5.5 test method.

It demonstrates a low dissipation factor of 0.0010 at 10 GHz and 23°C with 50% relative humidity, as determined by the IPC TM-650 2.5.5.5 test method.

The design value for the dielectric constant is 2.93, as determined through the Microstrip Differential Phase Length test method at 10 GHz and C-24/23/50 conditions.

CLTE-XT exhibits a thermal coefficient of dielectric constant of -8 ppm/°C, as measured from -50°C to 150°C at 10 GHz using the IPC TM-650 2.5.5.5 test method.

The volume resistivity is measured to be 4.25x10^8 Mohm-cm using the C-96/35/90 test method.

The surface resistivity is demonstrated at 2.49x10^8 Mohm as determined by the C-96/35/90 test method.

CLTE-XT exhibits an electrical strength of 1000 V/mil, as tested using the IPC TM-650 2.5.6.2 method.

The dielectric breakdown voltage is measured to be 58 kV in both X and Y directions using the D-48/50 test method.

Thermal Properties:

CLTE-XT has a decomposition temperature of 539°C, with a 5% weight loss observed over a 2-hour period at 105°C, according to the IPC TM-650 2.3.40 test method.

It displays a coefficient of thermal expansion of 12.7 ppm/°C in x-axis, 13.7 ppm/°C in y-axis, and 40.8 ppm/°C in z-axis over a temperature range of -55°C to 288°C, as measured by the IPC TM-650 2.4.41 test method.

The thermal conductivity is determined to be 0.56 W/(m·K) in the z direction according to ASTM D5470.

CLTE-XT demonstrates excellent resistance to delamination, with a minimum time of more than 60 minutes observed at 288°C under as-received conditions, as per the IPC TM-650 2.4.24.1 test method.

Mechanical Properties:

CLTE-XT exhibits a copper peel strength of 1.7 N/mm when subjected to thermal stress at 288°C for 10 seconds using 35 μm foil, as determined by the IPC TM-650 2.4.8 test method.

The flexural strength is measured to be 40.7 MPa in the machine direction (MD) and 40.0 MPa in the cross-machine direction (CMD) at 25°C ± 3°C, following the ASTM D790 test method.

It exhibits a tensile strength of 29.0 MPa in the MD and 25.5 MPa in the CMD at 23°C with 50% relative humidity, as per the ASTM D638 test method.

The flex modulus of CLTE-XT is measured to be 3247 MPa in the MD and 3261 MPa in the CMD at 25°C ± 3°C, following the ASTM D790 test method.

It displays excellent dimensional stability with a minimal change of -0.37 mm/m (MD) and -0.67 mm/m (CMD) after 4 hours at 105°C, as determined by the IPC-TM-650 2.4.39a test method.

Physical Properties:

CLTE-XT has achieved a V-0 rating according to the UL 94 standard, indicating excellent flame retardancy.

It exhibits low moisture absorption with a value of 0.02% as determined by the E1/105+D24/23 test method.

The density is measured to be 2.17 g/cm3 using the C-24/23/50 test method outlined in ASTM D792.

It has a specific heat capacity of 0.61 J/g·K after being subjected to 2 hours at 105°C, according to ASTM E2716.

NATA Outgassing:

CLTE-XT has a minimal total mass lost of 0.02% as determined by the ASTM E595 test method.

No specific data is provided for Collected Volatile Condensible Material.

Properties	CLTE-XT	Units	Test Conditions		Test Method
Properties	CLTE-XT	Units	Test Conditions		Test Method
Electrical Properties
Dielectric Constant	2.79 (5.1mil)	-	23˚C @ 50% RH	10 GHz	IPC TM-650 2.5.5.5
	2.89 (9.4mil)
	2.92 (20mil)
	2.94 (30mil)
Dissipation Factor	0.0010	-	23˚C @ 50% RH	10 GHz	IPC TM-650 2.5.5.5
Dielectric Constant (design)	2.93	-	C-24/23/50	10 GHz	Microstrip Differential Phase Length
Thermal Coefficient of Dielectric Constant	-8	ppm/˚C	-50°C to 150°C	10 GHz	IPC TM-650 2.5.5.5
Volume Resistivity	4.25x10⁸	Mohm-cm	C-96/35/90	-	IPC TM-650 2.5.17.1
Surface Resistivity	2.49x10⁸	Mohm	C-96/35/90	-	IPC TM-650 2.5.17.1
Electrical Strength (dielectric strength)	1000	V/mil	-	-	IPC TM-650 2.5.6.2
Dielectric Breakdown	58	kV	D-48/50	X/Y direc- tion	IPC TM-650 2.5.6
Thermal Properties
Decomposition Temperature (Td)	539	˚C	2hrs @ 105˚C	5% Weight Loss	IPC TM-650 2.3.40
Coefficient of Thermal Expansion - x	12.7	ppm/˚C	-	-55˚C to 288˚C	IPC TM-650 2.4.41
Coefficient of Thermal Expansion - y	13.7	ppm/˚C	-	-55˚C to 288˚C	IPC TM-650 2.4.41
Coefficient of Thermal Expansion - z	40.8	ppm/˚C	-	-55˚C to 288˚C	IPC TM-650 2.4.41
Thermal Conductivity	0.56	W/(m.K)	-	z direction	ASTM D5470
Time to Delamination	>60	minutes	as-received	288˚C	IPC TM-650 2.4.24.1
Mechanical Properties
Copper Peel Strength after Thermal Stress	1.7 (9)	N/mm (lbs/ in)	10s @288˚C	35 μm foil	IPC TM-650 2.4.8
Flexural Strength (MD, CMD)	40.7, 40.0 (5.9, 5.8)	MPa (ksi )	25˚C ±?3˚C	-	ASTM D790
Tensile Strength (MD, CMD)	29.0, 25.5 (4.2, 3.7)	MPa (ksi )	23˚C/50RH	-	ASTM D638
Flex Modulus (MD. CMD)	3247, 3261 (471, 473)	MPa (ksi )	25˚C ±?3˚C	-	ASTM D790
Dimensional Stability (MD, CMD)	-0.37, -0.67	mm/m	4 hr at 105˚C	-	IPC-TM-650 2.4.39a
Physical Properties
Flammability	V-0	-	-	C48/23/50 & ?C168/70	UL 94
Moisture Absorption	0.02	%	E1/105+D24/23	-	IPC TM-650 2.6.2.1
Density	2.17	g/cm³	C-24/23/50	-	ASTM D792
Specifc Heat Capacity	0.61	J/g˚K	2 hours at 105˚C	-	ASTM E2716
NATA Outgassing
Total Mass Lost	0.02	%	-	-	ASTM E595
Collected Volatiles Condensible Material	0	%	-	-	ASTM E595

Our PCB Capability (CLTE-XT)

For CLTE-XT PCB, we can provide you with single-sided, double-sided, multi-layer, or hybrid designed PCBs. The layer count is versatile and adaptable, making it suitable for a wide range of applications.

CLTE-XT PCB provides flexibility in dielectric thickness, catering to varying design requirements. It’s available with 5.1mil (0.130mm), 9.4mil (0.239mm), 20mil (0.508mm) and 30mil (0.762mm). Our designers have the freedom to customize the PCB thickness according to their specific needs.

To meet diverse application demands, CLTE-XT PCBs support different copper weights, including 1oz (35μm) or 2oz (70μm) copper weight. This ensures optimal conductivity for efficient power distribution and signal performance.

We can offer a maximum size of 400mm X 500mm, providing designers with ample space to unleash their creativity. This generous board size allows for the integration of complex circuitry, components, and advanced functionalities into a single board, reducing the need for multiple interconnected boards.

You can choose from a range of solder mask colors such as Green, Black, Blue, Red, Yellow, and more. This allows for better visual differentiation, identification, and customization, making your PCBs visually appealing and aligning with your branding or design preferences.

We support various surface finish options, including Immersion gold, HASL, Immersion silver, Immersion tin, ENEPIG, Bare copper, OSP, and Pure gold plated, allowing you to customize the finishes to suit your specific application requirements.

PCB Capability (CLTE-XT Laminates)
PCB material:	Ceramic/PTFE Microwave Composite
Designation:	CLTE-XT
Dielectric constant:	2.94
Layer count:	Sinlge-sided PCB, Double-sided PCB, Multi-layer PCB, Hybrid PCB
Dielectric thickness:	5.1mil(0.130mm), 9.4mil (0.239mm), 20mil (0.508mm), 30mil(0.762mm)
Copper weight:	1oz (35µm), 2oz (70µm)
Copper weight:	1oz (35µm), 2oz (70µm)
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Blue, Red, Yellow etc.
Surface finish:	Immersion gold, HASL, Immersion silver, Immersion tin,ENEPIG, Bare copper, OSP, Pure gold plated etc..

CLTE-XT PCB and Typical Applications

Now displayed on the screen is a type of CLTE-XT PCB that combined with FR-4 and features an immersion gold coating for phased array antennas.

We can also find its widespread applications across various cutting-edge technologies, including advanced driver assistance systems (ADAS), patch antennas, and power amplifiers etc.

Final

The CLTE-XT copper clad laminates are composite materials consisting of woven glass reinforcement filled with PTFE. These laminates exhibit exceptional thermal reliability and electrical performance. They are designed to be compatible with manufacturing processes for double-sided and multilayer circuits using PTFE materials.

The processing tools such as developers, strippers, and copper etchants commonly used in the fabrication of epoxy glass PCBs can also be utilized for CLTE-XT layers. However, when dealing with thin cores, it may be necessary to use leader boards for conveyorized processing or frames and supportive racks for vertical-type processing. Furthermore, the ceramic filled material requires more stringent rinse and bake processing, which may vary depending on the subsequent steps in the process sequence.

That concludes today's episode. Thank you for reading, and we'll see you next time.