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Rogers AD350A RF PCB Double Sided Board 30mil 0.762mm Thickness


Shipped: 29th-Nov-2023  

We are thrilled to introduce our latest delivery of the AD350A PCB, a cutting-edge solution that brings unparalleled performance to your high-power connectivity needs.

Introduction to AD350A:
The Rogers AD350A PCB substrate is a specialty material designed for high-power designs, offering high thermal conductivity and low coefficient of thermal expansion (CTE). With its woven fiberglass reinforced, ceramic-filled, PTFE-based composite construction, AD350A provides exceptional performance in applications where temperature extremes and heat rejection are critical factors.

Key Features:
Precisely controlled dielectric constant of 3.5 ± 0.05 at 10 GHz/23°C ensures reliable signal transmission.
Low loss tangent of 0.003 at 10 GHz, 23°C @ 50% RH, enabling efficient and high-performance circuitry.
Low Z-axis thermal expansion of 35 ppm/°C, ensuring dimensional stability under varying temperatures.
Decomposition Temperature (Td) exceeding 500°C, providing excellent thermal stability and reliability.
Moisture absorption rate of 0.1%, safeguarding against environmental factors and maintaining performance integrity.
Coefficient of Thermal Expansion (CTE) in X-axis of 18 ppm/°C, Y-axis of 18 ppm/°C, and Z-axis of 63 ppm/°C, providing stability in different temperature conditions.
Low PIM of -159dBC at 30 mils and -163dBC at 60 mils, ensuring superior antenna performance and reduced interference.
Good thermal conductivity of 0.44 W/m-K, facilitating effective heat dissipation.

Benefits:
Superior plated through-hole (PTH) adhesion, ensuring reliable connections.
Excellent heat dissipation and management, enabling reliable operation in high-power applications.
High consistency performance, ensuring reliable signal transmission and reception.

PCB Stackup: 2-layer rigid PCB
Copper_layer_1: 35 μm
AD350A: 0.762 mm (30 mil)
Copper_layer_2: 35 μm

PCB Construction Details:
Board dimensions: 102.02 mm x 65.54 mm (1PCS), with a tolerance of +/- 0.15 mm
Minimum Trace/Space: 4/4 mils
Minimum Hole Size: 0.3 mm
No blind vias
Finished board thickness: 0.8 mm
Finished copper weight: 1 oz (1.4 mils) for outer layers
Via plating thickness: 20 μm
Surface finish: Immersion Silver
No top or bottom silkscreen
No top or bottom solder mask
100% Electrical test conducted prior to shipment

PCB Statistics:
Components: 54
Total Pads: 123
Thru-Hole Pads: 90
Top SMT Pads: 33
Bottom SMT Pads: 0
Vias: 76
Nets: 3
Artwork Type: Gerber RS-274-X
Accepted Standard: IPC-Class-2
Availability: Worldwide

Typical Applications:
Cellular infrastructure base station antennas
Automotive telematics antenna systems
Commercial satellite radio antennas

Appendix: AD350A Data sheet

 

Electrical Properties

AD300D

AD350A

Units

Test Conditions

Test Method

PIM (30mil/60mil)

-159/-163

-159/-163

dBc

Reflected 43 dBm swept tones at 1900 MHz, S1/S1

Rogers Internal 50 ohm

Dielectric Constant (process)

2.97/3.03 (2.94/3.00)

3.54

-

23°C @ 50% RH

10 GHz
(1 MHz)

IPC TM-650 2.5.5.5
(IPC TM-650 2.5.5.3)

Dielectric Constant (design)

2.94/3.00

3.50

-

C-24/23/50

10 GHz

Microstrip Differential Phase Length

Dissipation Factor (process)

0.0021

0.0033

-

23°C @ 50% RH

10 GHz

IPC TM-650 2.5.5.5

Thermal Coefficient of Dielectric Constant

-73

-57

ppm/ºC

0°C to 100°C

10 GHz

IPC TM-650 2.5.5.5

Volume Resistivity

1.7 x 108

1.5 x 109

Mohm-cm

C-96/35/90

-

IPC TM-650 2.5.17.1

Surface Resistivity

5.1 x 107

9.5 x 107

Mohm

C-96/35/90

-

IPC TM-650 2.5.17.1

Electrical Strength (dielectric strength)

750

671

V/mil

-

-

IPC TM-650 2.5.6.2

Dielectric Breakdown

46

33

kV

D-48/50

X/Y direction

IPC TM-650 2.5.6

Thermal Properties

Decomposition Temperature (Td)

>500

>500

˚C

2hrs @ 105˚C

5% Weight Loss

IPC TM-650 2.3.40

Coefficient of Thermal Expansion - x

24

18

ppm/˚C

-

-55˚C to 288˚C

IPC TM-650 2.4.41

Coefficient of Thermal Expansion - y

23

18

ppm/˚C

-

-55˚C to 288˚C

IPC TM-650 2.4.41

Coefficient of Thermal Expansion - z

98

63

ppm/˚C

-

-55˚C to 288˚C

IPC TM-650 2.4.41

Thermal Conductivity

0.37

0.44

W/mK

-

z direction

ASTM D5470

Time to Delamination

>60

>60

minutes

as-received

288˚C

IPC TM-650 2.4.24.1

Mechanical Properties

Copper Peel Strength after Thermal Stress

3.2
(18.3)

2.6
(14.7)

N/mm (lbs/in)

10s @288˚C

35 μm foil

IPC TM-650 2.4.8

Flexural Strength (MD/CMD)

152.4/127.6 (22.1/18.5)

97.9/62.1 (14.2/9.0)

MPa (ksi )

25°C ± 3°C

-

ASTM D790

Tensile Strength (MD/CMD)

122.0/120.7 (17.7/17.5)

97.9/46.2 (14.2/6.7)

MPa (ksi )

23°C/50% RH

-

ASTM D3039/D3039-14

Flex Modulus (MD/CMD)

10,400/9,580 (1510/1390)

12,652/10,128 (1,835/1,469)

MPa (ksi )

25°C ± 3°C

-

IPC-TM-650 Test Method 2.4.4

Dimensional Stability (MD/CMD)

-0.08/0.02

0.15/0.17

mils/inch

after etch + bake

-

IPC-TM-650 2.4.39a

Physical Properties

Flammability

V-0

V-0

-

-

-

UL-94

Moisture Absorption

0.04

0.1

%

E1/105 +D48/50

-

IPC TM-650 2.6.2.1

Density

2.23

2.43

g/cm3

C-24/23/50

-

ASTM D792

Specific Heat Capacity

0.80

0.757

J/g°K

2 hours at 105°C

-

ASTM E2716

 
 
 
 
 
 
 
 
 
 
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