We are thrilled to share a type of our latest delivery of AD300D PCB, a breakthrough in high frequency technology that will revolutionize your connectivity experience.

Introduction to AD300D:
The Rogers AD300D high-frequency laminates are a cost-effective and versatile solution, offering a low and controlled dielectric constant, exceptional low-loss performance, and impressive PIM (passive intermodulation) response. Designed with a PTFE resin-based material, these ceramic-filled, glass-reinforced laminates enhance both electrical and mechanical performance while maintaining compatibility with standard PTFE fabrication methods.

Key Features:
Precisely controlled dielectric constant of 2.94 ± 0.05 at 10 GHz/23°C ensures consistent and reliable signal transmission.
Low loss tangent of 0.0021 at 10 GHz, 23°C @ 50% RH, enabling efficient and high-performance circuitry.
Decomposition Temperature (Td) exceeding 500°C, ensuring excellent thermal stability and reliability.
Moisture absorption rate of 0.04%, safeguarding against environmental factors and maintaining performance integrity.
Coefficient of Thermal Expansion (CTE) in X-axis of 24 ppm/°C, Y-axis of 23 ppm/°C, and Z-axis of 98 ppm/°C, providing dimensional stability even under varying temperature conditions.
Exceptionally low PIM of -159dBC at 30 mils, ensuring superior antenna performance and reduced interference.
Good thermal conductivity of 0.37 W/m-K at 100°C, enabling efficient heat dissipation and improved reliability.

Benefits:
Wide range of applications, making it suitable for various industries and connectivity needs.
Improved power handling capabilities, allowing for reliable operation under demanding conditions.
Low loss and higher antenna efficiency, ensuring optimal signal transmission and reception.
Maintains mechanical form during handling, providing ease of use and enhanced manufacturing efficiency.

PCB Stackup: 2-layer rigid PCB
Copper_layer_1: 35 μm
AD300D: 0.762 mm (30 mil)
Copper_layer_2: 35 μm

PCB Construction Details:
Board dimensions: 53.18 mm x 56.04 mm (1PCS), with a tolerance of +/- 0.15 mm
Minimum Trace/Space: 5/5 mils
Minimum Hole Size: 0.25 mm
No blind vias
Finished board thickness: 0.8 mm
Finished copper weight: 1 oz (1.4 mils) for outer layers
Via plating thickness: 20 μm
Surface finish: Immersion Silver
No top or bottom silkscreen
No top or bottom solder mask
100% Electrical test conducted prior to shipment

PCB Statistics:
Components: 16
Total Pads: 33
Thru Hole Pads: 21
Top SMT Pads: 12
Bottom SMT Pads: 0
Vias: 31
Nets: 2
Artwork Type: Gerber RS-274-X
Accepted Standard: IPC-Class-2
Availability: Worldwide

Typical Applications:
Cellular infrastructure base station antennas
Automotive telematics antenna systems
Commercial satellite radio antennas

Appendix: AD300D Data sheet