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Rogers AD250C Microwave and RF PCB Double Sided 60mil 1.524mm Thickness


Shipped: 6th-Nov-2023  

I am thrilled to announce the arrival of the AD250C PCB, a game-changer in the world of connectivity solutions.

Introduction to AD250C:
The AD250C by Rogers is a commercial microwave and RF laminate material specifically designed with a low and tightly controlled dielectric constant of 2.50. It is constructed using a cost-effective combination of composite chemistry and construction, delivering an exceptional level of price-performance for modern telecommunication infrastructure needs.

Key Features:
Rogers AD250C Woven Glass Reinforced PTFE Antenna Grade Laminates
Dielectric constant of 2.5 with tight tolerance at 10 GHz/23°C
Low loss tangent of 0.0013 at 10GHz and base station frequencies at 10 GHz/23°C
Decomposition Temperature (Td) exceeding 500°C
Moisture absorption rate of 0.04%
Coefficient of Thermal Expansion (CTE) in X-axis of 47 ppm/°C, Y-axis of 29 ppm/°C, and Z-axis of 196 ppm/°C

Benefits:
Low loss tangent (<0.002 at 10 GHz) for excellent circuit performance across various wireless frequency bands
Controlled dielectric constant (±0.05) ensures repeatable circuit performance, while the ceramic material provides higher Dk stability during temperature changes
Very low PIM (-159 dBc at 30 mil, 1900 MHz) results in excellent antenna performance and reduced yield loss associated with PIM-related issues
Excellent dimensional stability provides repeatable circuit performance and improved manufacturing yields, along with enhanced plated through-hole (PTH) reliability compared to typical PTFE-based laminates

PCB Stackup: 2-layer rigid PCB
Copper_layer_1: 35 μm
AD250C: 1.524 mm (60mil)
Copper_layer_2: 35 μm

PCB Construction Details:
Board dimensions: 355mm x 210 mm (1PCS), with a tolerance of +/- 0.15mm
Minimum Trace/Space: 6/6 mils
Minimum Hole Size: 0.4mm
No blind vias
Finished board thickness: 1.6mm
Finished copper weight: 1oz (1.4 mils) for outer layers
Via plating thickness: 20 μm
Surface finish: Hot Air Soldering Level
No top or bottom silkscreen
No top or bottom solder mask
100% Electrical test conducted prior to shipment

PCB Statistics:
Components: 118
Total Pads: 260
Thru Hole Pads: 118
Top SMT Pads: 142
Bottom SMT Pads: 0
Vias: 161
Nets: 3
Artwork Type: Gerber RS-274-X
Accepted Standard: IPC-Class-2
Availability: Worldwide

Typical Applications:
Cellular infrastructure base station antennas
Automotive telematics antenna systems
Commercial satellite radio antennas

Appendix: AD250C Data Sheet

 

Electrical Properties

AD250C

Units

Test Conditions

Test Method

PIM (30mil/60mil)

-159/-163

dBc

Reflected 43 dBm swept tones at 1900 MHz, S1/S1

Rogers Internal 50 ohm

Dielectric Constant (process)

2.52

-

23°C @ 50% RH

10 GHz

IPC TM-650 2.5.5.5
(IPC TM-650 2.5.5.3)

Dielectric Constant (design)

2.50

-

C-24/23/50

10 GHz

Microstrip Differential Phase Length

Dissipation Factor (process)

0.0013

-

23°C @ 50% RH

10 GHz

IPC TM-650 2.5.5.5

Thermal Coefficient of Dielectric Constant

-117

ppm/ºC

0°C to 100°C

10 GHz

IPC TM-650 2.5.5.5

Volume Resistivity

4.8 x 108

Mohm-cm

C-96/35/90

-

IPC TM-650 2.5.17.1

Surface Resistivity

4.1 x 107

Mohm

C-96/35/90

-

IPC TM-650 2.5.17.1

Electrical Strength (dielectric strength)

979

V/mil

-

-

IPC TM-650 2.5.6.2

Dielectric Breakdown

>40

kV

D-48/50

X/Y direction

IPC TM-650 2.5.6

Thermal Properties

Decomposition Temperature (Td)

>500

˚C

2hrs @ 105˚C

5% Weight Loss

IPC TM-650 2.3.40

Coefficient of Thermal Expansion - x

47

ppm/˚C

-

-55˚C to 288˚C

IPC TM-650 2.4.41

Coefficient of Thermal Expansion - y

29

ppm/˚C

-

-55˚C to 288˚C

IPC TM-650 2.4.41

Coefficient of Thermal Expansion - z

196

ppm/˚C

-

-55˚C to 288˚C

IPC TM-650 2.4.41

Thermal Conductivity

0.33

W/mK

-

z direction

ASTM D5470

Time to Delamination

>60

minutes

as-received

288˚C

IPC TM-650 2.4.24.1

Mechanical Properties

Copper Peel Strength after Thermal Stress

2.6
(14.8)

N/mm (lbs/in)

10s @288˚C

35 μm foil

IPC TM-650 2.4.8

Flexural Strength (MD/CMD)

8.8/6.4 (60.7/44.1)

MPa (ksi )

25°C ± 3°C

-

ASTM D790

Tensile Strength (MD/CMD)

6.0/5.6 (41.4/38.6)

MPa (ksi )

23°C/50% RH

-

ASTM D3039/D3039-14

Flex Modulus (MD/CMD)

885/778 (6,102/5,364)

MPa (ksi )

25°C ± 3°C

-

IPC-TM-650 Test Method 2.4.4

Dimensional Stability (MD/CMD)

0.02/0.06

mils/inch

after etch + bake

-

IPC-TM-650 2.4.39a

Physical Properties

Flammability

V-0

-

-

-

UL-94

Moisture Absorption

0.04

%

E1/105 +D48/50

-

IPC TM-650 2.6.2.1

Density

2.28

g/cm3

C-24/23/50

-

ASTM D792

Specific Heat Capacity

0.813

J/g°K

2 hours at 105°C

-

ASTM E2716

 
 
 
 
 
 
 
 
 
 
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