Introducing the 370HR PCB, a high-quality printed circuit board (PCB) constructed with Isola's renowned 370HR laminate material, known for its exceptional performance and reliability.

Introduction to 370HR:
The 370HR laminates and prepregs utilize a patented high-performance epoxy resin system with a Tg (glass transition temperature) of 180°C, specifically designed for multilayer Printed Circuit Board (PCB) applications that require maximum thermal performance and reliability. Isola's 370HR laminates and prepregs are constructed with high-quality E-glass fabric, ensuring exceptional resistance to Conductive Anodic Filament (CAF). Additionally, 370HR offers superior thermal performance, low Coefficient of Thermal Expansion (CTE), and mechanical, chemical, and moisture resistance properties that surpass or match those of traditional FR-4 materials.

Key Features:
UL Certification
RoHS Compliance
Resistance to Conductive Anodic Filament (CAF)
Glass Transition Temperature (Tg) of 180°C, determined by DSC (Differential Scanning Calorimetry)
Decomposition Temperature (Td) of 340°C, measured by TGA (Thermogravimetric Analysis) at 5% weight loss
Time to Delaminate, determined by TMA (Thermomechanical Analysis) with copper removed: 60 minutes at T260, 30 minutes at T288

Benefits:
Compatibility with FR-4 processes
UV blocking and AOI (Automated Optical Inspection) fluorescence
Capable of multiple reflows
Compatible with HDI (High-Density Interconnect) technology

PCB Stackup: 8-layer rigid PCB
Layer Function Thickness (mil)
Signal L1 Top 1.4
Prepreg 4.0
Plane L2 GND 1.4
HR370 Core 4.0
Signal L3 SIG1 1.4
Prepreg 4.0
Plane L4 PWR 1.4
HR370 Core 5.0
Plane L5 GND2 1.4
Prepreg 4.0
Signal L6 SIG2 1.4
HR370 Core 4.0
Plane L7 PWR2 1.4
Prepreg 4.0
Signal L8 Bottom 1.4

PCB Construction details:
Board dimensions: 122.87mm x 148.5mm (4PCS), with a tolerance of +/- 0.15mm
Minimum Trace/Space: 4/4 mils
Minimum Hole Size: 0.2mm
No Blind vias
Finished board thickness: 1.0mm
Finished Copper weight: 1oz (1.4 mils) for both inner and outer layers
Via plating thickness: 20 μm
Surface finish: Immersion gold (4 micro-inches)
Top Silkscreen: White
Bottom Silkscreen: White
Top Solder Mask: Green
Bottom Solder Mask: Green
Top layer has 11mil tracks with a controlled impedance of 50 ohms
100% Electrical test conducted prior to shipment

PCB Statistics:
Components: 71
Total Pads: 116
Thru Hole Pads: 65
Top SMT Pads: 51
Bottom SMT Pads: 0
Vias: 152
Nets: 7

Type of artwork supplied: Gerber RS-274-X
Accepted standard: IPC-Class-2
Availability: Worldwide

Some Typical Applications:
Computing, storage & peripherals
Consumer electronics
Networking & Communications
Medical, Industrial & instrumentation
Automotive & transportation

Appendix: 370HR Data sheet