Double Sided PCB
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High Tg170 PCB
Blind Via PCB
Quick Turn Prototype PCB
Save Tooling Cost Prototype
Gold Finger PCB
Heavy Copper PCB
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CSP-mounted PCB
Impedance Controlled PCB
Multi-layer PCB
Medium to Volume Production
Metal Core / LED PCB
Mixed material PCB
Laser Cut SMT Stencil



Impedance Controlled PCB

Bicheng has beening providing impedance controlled PCB's for RD companies, high-tech institute, IT research companies and organizations, large or small.
Basic elements to impedance control
- Thickness of trace (T1) 7%
- Width of trace (W1) 4%
- Height of laminate (H1) 35%
- Dielectric constant of board material (Er1) 8%
Other factors can be involved, however they have much less affect on the impedance such solder resist, thickness of tin and lead, PCB humidity etc
Main factors affected impedance control (normally ±10%)
- Generally, desinged width of trace is already fixed, manufacturing procedure is controlled within ±15-20%
- Generally, the thickness of trace is already fixed at designing period, manufacturing procedure of electroplate is controlled within ±0.8-1.2mil
- The dielectric constant of the substrate is almost fixed, no much big changes.
- The above-mentioned factors can be controlled stably, the main affecting factor of impedance control is only left height of laminate.
Main factors to the height of laminate
- thickness of inner layer copper
- residual rate of inner layer copper
- use which kind of prepreg
Testing the PCB
PCB testing is normally done on one test coupon integrated into the PCB panel, not on the PCB itself. Coupons are designed for specific time domain reflectometer.
Test Coupon
Time domain reflectometer (TDR)


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