Bicheng Enterprise Limited
碧 澄 實 業 有 限 公 司






PCB Capabilities 2018
Item Production Capability (Summery)
Layer Counts 1-32
Substrate Material FR-4(including High Tg 170, High CTI>600V); Aluminum based; RO4350B, RO4003C; XPC and FR-1 (upon request)
Maximum Size Flying test: 900*600mm, Fixture test 460*380mm, No test 1100*600 mm
Board Outline Tolerance ±0.15 mm
PCB Thickness 0.20 mm--6.00 mm
Thickness Tolerance(T≥0.8mm) ±8%
Thickness Tolerance(t<0.8mm) ±10%
Insulation Layer Thickness 0.075 mm--5.00 mm
Minimum Track 0.075 mm
Minimum Space 0.075 mm
Outer Copper Thickness 35 um--420 um
Inner Copper Thickness 17 um--210 um
Drill Hole(Mechanical) 0.15 mm--6.35 mm
Finished Hole(Mechanical) 0.10 mm--6.30 mm
DiameterTolerance(Mechanical) 0.075 mm
Registration (Mechanical) 0.05 mm
Aspect Ratio 12:1
Solder Mask Type LPI
Minimum Soldermask Bridge 0.08 mm
Minimum Soldermask Clearance 0.05 mm
Plug via Diameter 0.25 mm--0.60 mm
Impedance Control Tolerance ±10%
Surface Finish HASL, HASL Lead Free, Immersion Gold, Immersion Tin, Immersion Silver, OSP, Gold Finger




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