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PCB Capability

Item

Production Capability (Summery)

 Layer Counts 

1-32

 Substrate Material

FR-4(including High Tg 170, High CTI>600V); Aluminum based; RO4350B, RO4003C; XPC and FR-1 (upon request)

 Maximum Size

 Flying test: 900*600mm, Fixture test 460*380mm, No test 1100*600mm

 Board Outline Tolerance

 \0.15mm

 PCB Thickness

 0.20mm--6.00mm

Thickness Tolerance(T−0.8mm)

 \8%

Thickness Tolerance(t0.8mm)

 \10%

 Insulation Layer Thickness

 0.075mm--5.00mm

 Minimum Track

 0.075mm

 Minimum Space

 0.075mm

 Outer Copper Thickness

 35um--420um

 Inner Copper Thickness

 17um--210um

 Drill Hole(Mechanical)

 0.15mm--6.35mm

 Finished Hole(Mechanical)

 0.10mm--6.30mm

DiameterTolerance(Mechanical)

 0.075mm

 Registration (Mechanical)

 0.05mm

 Aspect Ratio

 12:1

 Solder Mask Type

 LPI

 Min Soldermask Bridge

 0.08mm

 Min Soldermask Clearance

 0.05mm

 Plug via Diameter

 0.25mm--0.60mm

Impedance Control Tolerance

 \10%

 Surface Finish

HASL,HASL LF,ENIG,Imm Tin,Imm Ag, OSP, Gold Finger

 

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