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8 Layer Fine Pitch micro BGA Immersion gold PCB

PCB dimension: 95 x 100mm=1PCS
Basic stack up: 8 Layer PCB
  copper ------- 18um(0.5oz)+plate TOP layer
  Prepreg 7628 0.195mm
  copper ------- 35um(1oz) MidLayer 1
  FR-4 0.2mm
  copper ------- 35um(1oz) MidLayer 2
  Prepreg 7628 0.195mm
  copper ------- 35um(1oz) MidLayer 3
  FR-4 0.2mm
  copper ------- 35um(1oz) MidLayer 4
  Prepreg 7628 0.195mm
  copper ------- 35um(1oz) MidLayer 5
  FR-4 0.2mm
  copper ------- 35um(1oz) MidLayer 6
  Prepreg 7628 0.195mm
  copper ------- 18um(0.5oz)+plate BOT Layer
Minimum trace and space 4mil/4mil
Minimum / maximum holes 0.3/2.5mm
Number of different holes 16
Number of drill holes 12530
Number of milled slots 0
Material: ITEQ IT180A TG170?
Surface finish: Immersion gold (13.1% area)
Solder mask: Gloss green
Contour: rout (mill)
Via: plated through hole(PTH), minimum size 0.3mm
Final height of PCB 1.6mm ±%10
function: BGA mounted PCB

 

 

 

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