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Double Layer MCPCB

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Via in pad PCB Built on FR-4 with Immersion gold
 
  1.1 General description
  This is a type of multilayer PCB built on FR-4 substrate with Tg 150°C for the application of X-ray equipment. It's 2.0 mm thick with white silkscreen(Taiyo) on green solder mask (Taiyo) and immersion gold on pads. The base material is from ITEQ supplying 2 up PCBs per panel. They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 20 panels are packed for shipment.
 
  1.2 Features and benifits
  Very Low Moisure Absorption and better CAF resistance
Excellent surface planarity for CSP mounted components to reduce failure rate during assembly and soldering.
High assembly density and small size
Comprehensive equipment management and maintenance and process control
ISO9001, ISO14001, UL certified manufacturing factory.
Eligible products rate of first production: >95%
No MOQ, low cost for prototypes and small runs quantity.
 
  1.3 Application
  Dsl Modem, Bluetooth For PC, Vehicle Tracker, GPS Vehicle Tracking, Wi Fi Antenna, Electronic Counter, USB Wireless Router, DCDC Converter, Multicoupler Antenna, Space probe equipment
   
  1.4 Parameter and data sheet
 
Base Material: FR-4 Tg150℃, er<5.4.IT-158, ITEQ
Copper Weight: 1 oz each layer
Board Thickness: 2.0 mm ±10%
Layer Count: 6 layers
Board Size: 221 x 281mm=2PCS
Solder Mask: Green solder mask | white silkscreen
Surface Finish: Immersion gold
Via: via in pad tented
Warpage: <0.75%
Net Weight: 0.221 kg/panel
Acceptable Standard: IPC-Class-2
Lead time for prototype: 10 working days
Shelflife: 6 months
   
 
 

 

 

 
 

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