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LATEST SHIPMENT
Double sided MCPCB, HASL LF
RO4003C(32 mil) immersion gold PCB
Quick Turn Prototype PCB
ITEQ 10 Layer FR-4 TG170 PCB
CSP-mounted via in pad PCB
micro BGA immersion gold PCB
RO4350B(30mil) Immersion Gold PCB
Impedance controlled PCB
Mixed material 10 Layer PCB

 

 

6 layer CSP mounted via in pad PCB

PCB dimension: 93.25 x 104.12mm=1PCS
Basic stack up: 6 Layer PCB
  copper ------- 18um(0.5oz)+plate TOP layer
  Prepreg 7628 0.195mm
  copper ------- 18um(0.5oz) MidLayer 1
  FR-4 0.1mm
  copper ------- 18um(0.5oz) MidLayer 2
  Prepreg 7628 0.195mm
  copper ------- 18um(0.5oz) MidLayer 3
  FR-4 0.1mm
  copper ------- 18um(0.5oz) MidLayer 4
  Prepreg 7628 0.195mm
  copper ------- 18um(0.5oz)+plate BOT Layer
Minimum trace and space 4mil/4mil
Minimum / maximum holes 0.2/1.3mm
Number of different holes 11
Number of drill holes 9840
Number of milled slots 0
Material: SHENGYI FR-4
Surface finish: Immersion gold (19.1% area)
Solder mask: Gloss green
Contour: rout (mill)
Via:

plated through hole(PTH), min. size 0.2mm, via in pad technique, blind via from TOP to midLayer 1

Final height of PCB 1.1mm ±0.1
function: CSP mounted PCB

 

 

 

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