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Mixed material 10 Layer PCB

 

 

10 Layer PCB, RO4350B, RO4450B mixed with FR-4

PCB dimension: 210 x 85mm=1PCS
Basic stack up: 10 Layer PCB
  copper ------- 35um(1oz)+plate TOP layer
  RO4350B core 0.168mm
  copper ------- 18um(0.5oz) MidLayer 1
  RO4450B Prepreg (2x0.1) 0.2mm
  copper ------- 18um(0.5oz) MidLayer 2
  RO4350B core 0.168mm
  copper ------- 18um(0.5oz) MidLayer 3
  RO4450B Prepreg (2x0.1) 0.2mm
  copper ------- 18um(0.5oz) MidLayer 4
  RO4350B core 0.168mm
  copper ------- 18um(0.5oz) MidLayer 5
  RO4450B Prepreg (2x0.1) 0.2mm
  copper ------- 18um(0.5oz) MidLayer 6
  RO4350B core 0.168mm
  copper ------- 18um(0.5oz) MidLayer 7
  FR-4 pregpreg 0.1mm
  copper ------- 18um(1oz) MidLayer 8
  FR-4 core 0.1mm
  copper ------- 35um(1oz)+plate BOT Layer
Minimum trace and space 5.9mil/5.9mil
Number of drill holes 11385
Material: RO4350B, RO4450B mixed with FR-4 TG>135
Surface finish: Immersion gold (27.6% area)
Solder mask: Red
Contour: rout
Via: plated through hole(PTH), min. size 0.3mm
Final height of PCB 1.69mm
function: 8 x 8 matrix, both directions, up to 3.5GHz

 

 

 

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